Description
Quartz rings sit inside process equipment as wear, spacing or interface components. They are commonly used around a wafer or electrode in plasma etch equipment, and as stepped or spacer rings in furnace and vacuum assemblies. The purchasing decision is defined by OD, ID, thickness and any step, hole, slot or notch geometry matched to the chamber design rather than by a generic ring size series.
Dimensions
| Parameter | Specification |
|---|---|
| OD / ID | Matched to chamber and wafer geometry, including 200 mm and 300 mm-class fab equipment |
| Thickness | Specified to the required chamber stack height and interface geometry |
| Step Geometry | Single-step or multi-step profile |
| OD / ID Tolerance | ±0.08 mm achievable for OEM-specific chamber designs |
| Mounting Hole Position Accuracy | ≤ ±0.1 mm across a 100 mm span for CNC-drilled features |
| Batch-to-Batch Deviation | <0.05 mm for repeat production when the same controlled process is maintained |
Etch & Focus Ring Use
- Installed around the wafer/electrode region in plasma etch chambers as a chamber-matched process component.
- Ring geometry helps define gas-flow and edge conditions around the wafer processing area.
- Focus-ring designs are used to control plasma-edge conditions and support more uniform ion bombardment near the wafer perimeter.
- Advanced semiconductor applications may require ultra-high-purity quartz and tightly controlled surface cleanliness; the exact purity and particle specification should be tied to the chamber/process requirement rather than treated as a universal ring-stock value.
Mounting Features
- Precision-drilled mounting holes for chamber alignment and installation.
- Slots and notches for orientation, indexing or hardware clearance.
- Custom hole count and asymmetric patterns are supported when defined by the chamber drawing.
- Multi-feature parts can combine holes, steps, slots and notches on the same ring.
Surface Finish
- Fine grinding and polishing available to reduce surface roughness and particle adhesion.
- Transparent fused quartz is standard for many semiconductor and vacuum components.
- Opaque / milky quartz can be selected for applications where optical transparency is not required and thermal-radiation behavior is more important.
Material
High-purity fused quartz cylinder, plate or preform stock is selected according to ring size and process requirement. Semiconductor chamber components typically prioritize low metallic contamination, low bubble/defect content and controlled hydroxyl level, with the final grade tied to the chamber OEM or process specification.
What to Specify
| Parameter | Quotation Input |
|---|---|
| Base Geometry | OD, ID and finished thickness |
| Profile | Flat, single-step or multi-step; include step diameter and depth |
| Mounting Features | Hole count, diameter, pitch-circle or XY position; slots/notches if required |
| Surface | Ground, polished or application-specific surface condition |
| Equipment Match | Chamber model, wafer size or existing OEM ring drawing when available |
| Repeat Requirement | Prototype, replacement quantity or controlled repeat production |
FAQ
What tolerance can you hold on OD/ID for an OEM-specific ring design?
±0.08 mm on OD and ID is an achievable target for custom chamber-matched ring designs. For repeat orders, batch-to-batch dimensional deviation can be controlled below 0.05 mm when the same material and machining route are maintained.
Do you supply focus rings as well as general process rings?
Yes. A focus ring is treated as a chamber-specific quartz ring variant whose OD, ID, steps, edge geometry and mounting features are defined by the plasma-process and chamber interface.
Can mounting holes be positioned asymmetrically?
Yes. CNC-drilled holes can follow asymmetric patterns, with position accuracy controlled against the supplied datum scheme and drawing.