Custom Quartz Wafers

Quartz wafers for semiconductor, MEMS, and optical applications, sized and polished to the geometry your process actually needs — not just a thin round disc.

Diameter, thickness, TTV, bow, and warp are one coupled set, not separate specs — a large-diameter, thin wafer amplifies geometric instability, so tighter TTV/bow/warp gets harder to hold as diameter goes up and thickness goes down. Confirm the full combination, not one number in isolation.

Quartz Wafer Sizes, Polish Options and Edge Formats

Standard diameters follow common semiconductor wafer sizes (1", 2", 3", 4", 6"); other diameters are available but confirmed per order rather than offered as standard stock. Single-side polish is typical when only the device side needs optical-quality finish; double-side polish is used when both faces are in the optical path or need matched flatness. Edge format — as-cut, rounded (to reduce chipping in handling), or with a notch/flat for orientation — is chosen based on your process tooling, not by default.

TTV, Bow, Warp and Surface Finish

These three geometry numbers describe different things and are measured differently: TTV is the thickness variation across the wafer, bow is the deviation of the wafer's center from a reference plane with the wafer unclamped, and warp is the total peak-to-valley deviation across the surface. A wafer can meet a TTV spec and still fail a bow or warp spec — specify what your process actually depends on rather than assuming one number covers all three.

Quartz Wafers Factory Standard & Manufacturing Limit

The table above is what's repeatable without added lead time. Pushing thickness down at a large diameter is the combination most likely to need confirmation before we commit to a schedule — thin, large-diameter wafers are the hardest to hold flat through grinding and polishing.

Choosing Quartz Wafer Thickness and Surface Quality

Thickness is usually set by your process (mechanical strength needed for handling, or a target for later thinning) rather than chosen for its own sake — tell us your end-use thickness and whether it's a final spec or a starting point for further thinning on your side. Surface quality (roughness, particle/scratch requirements) should match what your process actually inspects for, since tighter-than-needed surface specs add cost without adding function.

Wafer Grinding, Thinning, Polishing and Edge Finishing

Wafers are cut from ingot or blank stock, then ground to rough thickness, thinned to final thickness, and polished on one or both sides as specified. Edge rounding or notching is done after polishing so it doesn't affect the flat surfaces. Before shipment we check diameter, thickness, TTV, bow, warp, surface condition, and edge format; particle and scratch inspection is reported where our inspection capability supports it — confirm your specific requirement so we can tell you whether it's covered.