Custom Quartz Sputtering Targets

Quartz sputtering targets machined to size, thickness, and flatness for PVD and thin-film work — where material purity and surface condition determine deposition quality, not just target dimensions.

Material purity and mechanical spec (thickness, flatness, surface finish) both affect target performance and are confirmed together — a correctly-sized target with unconfirmed purity isn't a complete spec for a sputtering application.

Purity, Density, Surface Finish and Backing Requirements

Purity and density directly affect film quality and deposition consistency; these are confirmed against a real material certificate for your order rather than published as a generic number here, since they depend on the specific quartz stock used. Surface finish on the sputtering face affects initial burn-in behavior — a rougher surface takes longer to reach stable sputtering conditions than a well-ground one.

Quartz Sputtering Targets Functional Standard & Manufacturing Limit

Backing (bonding the target to a metal support plate for better thermal and mechanical stability during sputtering) is available where our current bonding capability supports your target size and material — confirm before assuming it's included. Target size range, thickness tolerance, and flatness in the table above represent standard capability; larger or thinner targets may need confirmation before we commit to a schedule.

Material and Bonding Requirements

Tell us your deposition process (magnetron sputtering, RF, etc.) and target application, since that affects whether bonding is needed and what thickness makes sense — a thin target may need backing for handling and thermal stability that a thick target doesn't. Fabrication is precision blank preparation, cutting, grinding, and polishing to final flatness and surface finish, with cleaning before packaging. Before shipment we check dimensions, thickness, flatness, surface condition, and — where available — purity/density documentation.