Custom Grooved & Slotted Quartz Plates
| Parameter | Factory Standard | Manufacturing Limit |
|---|---|---|
| L×W×T | Up to 300 × 300 mm | Larger on request |
| Groove width | 0.3–5 mm | Narrower via laser, confirmed per order |
| Groove depth | 0.2–5 mm | Limited by remaining wall below groove |
| Pitch (for multiple grooves) | ≥2–3× groove width | Tighter pitch narrows remaining wall between grooves |
| Groove profile | U-, V-, or square-groove | — |
| Position tolerance | ±0.02–0.05 mm | Tighter, confirmed per order |

Quartz plates with grooves or slots cut to a defined width, depth, pitch, and position — sized around the feature, not just the plate outline.
Groove width, depth, pitch, and the plate's remaining wall thickness are one coupled set — a deeper or wider groove, or a tighter pitch between grooves, eats into the material left around it. Send the full groove layout together, not one dimension at a time.
Available Shapes, Sizes and Surface Options
Grooved plates start from standard flat stock — see our Quartz Plates line for the base material options. Grooves are added after the plate is cut and ground to size, on one or both faces as needed.
Groove Width, Depth, Pitch and Position
Groove depth is checked against the plate's total thickness, not specified as an independent number — a groove that's too deep for the plate leaves too little wall below it to survive handling or the machining itself. Position is measured from the plate edge or a stated datum, and pitch (spacing between repeated grooves) is checked as consistent across the full pattern, not just between any two adjacent grooves.
Grooved & Slotted Quartz Plates Factory Standard & Manufacturing Limit
The table above is what's repeatable without added lead time. Minimum groove width and maximum groove depth aren't both available at the same time on a thin plate — flag which matters more for your application. Before shipment we check groove width, depth, pitch, position, profile, edge condition (burrs/chipping), and overall plate flatness.
Width, Depth, Radius and Pitch Are One Feature Set
| Controlled Feature | Reference Capability / Requirement |
|---|---|
| Plate Size / Thickness | Finished plate envelope and remaining section below the groove |
| Groove Profile | U / V / square / through-slot / custom |
| Groove Width | Reference ≥0.3 mm |
| Groove Depth | Dimensioned from the working face |
| Pitch | Center-to-center spacing across the groove array |
| Bottom Radius | Tool radius or V-angle shown on the section view |
| Position Tolerance | Reference ±0.05 mm where the array aligns components |
| Flatness | Specified after grooving over the functional support area |
Reference Groove Arrays for Process Hardware
| Pitch | Typical Array | Drawing Priority |
|---|---|---|
| 2.54 mm | Fine carriers and compact component arrays | Groove width, depth and accumulated pitch |
| 4.76 mm | Wafer support and cleaning fixtures | Wafer edge contact and groove angle |
| 10 mm | Wide process spacing and baffle arrays | Plate flatness and groove position |
| Custom | Non-uniform or indexed groove pattern | Datum origin and every pitch transition |
Channels Matched to the Part They Locate
Grooved Quartz Process Hardware
Grade-Qualified Material Purity
Electric-fused / flame-fused quartz: SiO₂ ≥99.99%; synthetic JGS1-grade fused silica: ≥99.999%. Grade and lot certificate govern supplied material.
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