Custom Quartz Wafer Carriers & Holders

Quartz carriers and holders built around your wafer size and equipment interface — where the wafer contacts the part, and how the part sits in your equipment, are the specs that actually matter.

Wafer size, support geometry, and equipment envelope are one coupled set — a support point sized for the wafer OD still has to fit inside your equipment's available space, so send both together rather than wafer size alone.

Quartz Wafer Carriers & Holders for Semiconductor and Thermal Processing

Carriers and holders position one or more wafers for a specific process step — loading into a furnace, aligning under a process head, or holding a wafer during inspection. Which contact and support style fits depends on the process: a step that can't tolerate backside contact needs edge-only support, while a step needing more stability can use a full pocket.

Available Quartz Wafer Carriers & Holders Configurations

Single-wafer holders and multi-wafer carriers (cassette-style, with repeated slots) are both built on the same support principles. Tell us whether your application holds one wafer per part or several, since that changes whether pitch and slot count matter.

Wafer Support Points and Slot Geometry

Support point geometry determines contact area and particle risk — 3-point support minimizes contact but offers less stability, edge-ring support distributes contact around the wafer edge, and full-pocket support gives the most stability but the most contact area. Holes or pockets for support features are cut by mechanical or diamond drilling down to about Ø0.8 mm at ±0.02 mm, or by laser for finer features.

Quartz Wafer Carrier and Holder Designs

Frame size and handle geometry are set by how the part loads into and out of your equipment, not by wafer size alone — send your equipment model or a sketch of the loading mechanism if you have one. Fabrication is rod or plate stock machined for support features, then welded into the final frame; before shipment we check slot/support position, parallelism, overall dimensions, and weld points.

4–12 inWafer Formats

2.54 mmFine Pitch Reference

4.76 mmProcess Pitch Reference

10 mmWide Pitch Reference

3Core Structures

Low OHMaterial Option

Support Geometry

Locate Each Wafer from Functional Contact Points

Controlled Feature	Reference Capability / Requirement
Supported Wafer	4, 6, 8 or 12 inch; custom substrates by drawing
Structure	Open basket, enclosed carrier or tray-style holder
Capacity	Defined from process batch size and equipment envelope
Slot / Support Pitch	2.54, 4.76 or 10 mm reference series, or custom
Contact Geometry	Support points and edge clearance stated on the drawing
Handle / Transfer Interface	Fixed handle, removable interface or robot-compatible feature
Overall Envelope	Matched to the tank, furnace or transfer station
Material / Packaging	Low-OH quartz and clean packaging scope specified in the quotation

Structure Selection

Choose the Carrier Around the Transfer Step

Structure	Best Used When	Critical Drawing Inputs
Open carrier	Drainage and chemical access are primary	Wafer contact, pitch, handle
Box carrier	Protection during movement or storage is primary	Opening, cover and retention
Tray holder	Horizontal positioning is required	Support plane and pocket geometry
Custom frame	Existing equipment dictates the layout	Datums, envelope and transfer interface

Available Forms

Configurations Defined by the Process

Open CarrierAccessible frame for wet-process circulation

Enclosed CarrierProtective support and retention geometry

Tray HolderHorizontal pockets or support points

Custom Transfer FrameEquipment-specific handle and locating features

Applications

Wafer Transport and Process Support

Wet CleaningOpen structures for chemistry circulation and drainage

Furnace LoadingQuartz supports matched to thermal-process equipment

Intermediate StorageDefined wafer contact and retention during handling

Equipment TransferCarrier geometry matched to manual or automated tooling

Product Examples

Product Forms and Finished Components

Need a carrier matched to process equipment?Send wafer size, capacity, pitch, contact geometry, overall envelope and transfer or handle details.

Open the Product Configurator

Engineering Data

Grade-Qualified Material Purity

Electric-fused / flame-fused quartz: SiO₂ ≥99.99%; synthetic JGS1-grade fused silica: ≥99.999%. Grade and lot certificate govern supplied material.

Holder compatibility with 4–12 in customer wafers describes the fixture envelope. It is separate from the quartz-wafer product line, whose standard manufactured wafer series is 25.4–150 mm (1–6 in). State wafer diameter, slot pitch and loading orientation on the fixture drawing.